home
Financial/EMV
Government &
Secure ID
Telecommunications
Casino/Loyalty
Solutions
Healthcare
Service Bureau/TPA
IP/Wireless
Electronic payment
Internet transactions
Loyalty
SDK
 
 

Some areas of this site require Adobe Reader. Click the icon to download.
Get Acrobat Reader

Contact Us
Semiconductor/Wafer Handling
Wafer Packing & Inspection
Home > Semiconductor/Wafer Handling> Wafer Packing & Inspection

NBS Technologies designs and manufactures automated systems for handling, sorting, packing, unpacking and inspection of wafers.

Our expertise in the area of wafer packing is allowing us to continuously develop new solutions for the Semiconductor industry. NBS has aquired considerable skill and know-how in the wafer packing and sorting, HSMS/SECS/GEM/300mm communication and ultra thin wafer handling arenas. We offer solutions for wafer sizes of 125mm, 150mm, 200mm and 300mm.

Moreover, NBS can provide you with a solution for wafer inspection. Thanks to the continued development of our expertise, our wafer back side visual inspection equipment automatically detects silicon micro-cracks and peripheral breakages on the back side of wafers.

Let NBS show you how we can deliver the right solution for your wafer packing and inspection needs.

For more information on our Wafer Handling product line please contact us at info@nbstech.com

 


WPC200 Advance

WPC 300
Collective 300mm wafer packing


WPC300
WPC 200 Advance
Collective 200mm wafer packing


WBI200
WBI 200
Wafer Back Side Visual Inspection

 



Home | About us | Solutions | Products | Dealers & Partners | Support | Investors | Careers | Site Map | Contact us


© 2004 NBS Technologies Inc.
Terms of Use
webmaster@nbstech.com

You are visitor

Solutions About Us contact us Dealers & Partners careers Support sitemap Home Products Investors