We are leaders in the development and manufacture of wafer handling and inspection equipment. Our technological expertise in the wafer handling process (wafer packing, ultra thin wafer handling) make our systems extremely safe and secure. Our industrial vision specialists have developed advanced systems for automatic inspection of peripheral breakages, back-side silicon micro cracks, cosmetics, as well as wafer geometry (thickness, bow, warp). In addition, our systems are compliant with the SEMI* standard required by the semiconductor industry.
Click here for more detail on our Wafer Packing and Inspection Product Line.
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