Our expertise in the area of wafer packing is allowing us to continuously develop new solutions for the Semiconductor industry. NBS has acquired considerable skill and know-how in the wafer packing and sorting, HSMS/SECS/GEM/300mm communication and ultra thin wafer handling arenas. We offer solutions for wafer sizes of 125mm, 150mm, 200mm and 300mm.
Moreover, NBS can provide you with a solution for wafer inspection. Thanks to the continued development of our expertise, our wafer back side visual inspection equipment automatically detects silicon micro-cracks and peripheral breakages on the back side of wafers.
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